JPH01160872U - - Google Patents
Info
- Publication number
- JPH01160872U JPH01160872U JP4828988U JP4828988U JPH01160872U JP H01160872 U JPH01160872 U JP H01160872U JP 4828988 U JP4828988 U JP 4828988U JP 4828988 U JP4828988 U JP 4828988U JP H01160872 U JPH01160872 U JP H01160872U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- metal
- metal substrate
- substrate
- wiring circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4828988U JPH01160872U (en]) | 1988-04-12 | 1988-04-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4828988U JPH01160872U (en]) | 1988-04-12 | 1988-04-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01160872U true JPH01160872U (en]) | 1989-11-08 |
Family
ID=31274448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4828988U Pending JPH01160872U (en]) | 1988-04-12 | 1988-04-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01160872U (en]) |
-
1988
- 1988-04-12 JP JP4828988U patent/JPH01160872U/ja active Pending